What does WOW mean in ELECTRONICS

Wafer on wafer (WOW) is an advanced packaging technique used in semiconductor technology that involves two die, or wafers, being stacked one atop the other with an adhesive layer between them. The use of this process allows for added functionalities such as higher levels of integration, improved reliability, and compact form factor.

WOW offers several advantages to semiconductors, including improved reliability and increased functionality. This is due to the stacking of two die which eliminates concerns about contamination from environmental factors such as humidity or dust particles entering the package. Additionally, by adding additional layers to a package, more components can be included than when using traditional packaging technologies.

Compared to traditional packaging methods like through-hole mounting and flat packages, WOW can offer better performance due to its ability to stack multiple layers of components together in a single package without increasing the overall size of the device. This can result in better signal integrity and decreased power consumption when compared to other technologies. Additionally, it allows for more complex designs without compromising reliability or size constraints.

As with all technology choices, there are some potential drawbacks associated with using WOW for certain applications. First off it requires special handling techniques during assembly due its multi-layer nature which can increase costs if not done properly. Secondly it may require specialized equipment for production runs which could also add cost when performed at smaller scale fabrication facilities.

Yes! Many vendors offer design guidelines that take into account both technical and economic considerations when designing packages using this process. These guidelines focus on the necessary steps needed during implementation such as layout considerations, adhesion materials selection and assembly techniques.