What does T-CPMC mean in IEEE
The abbreviation IEEE T-CPMC refers to the IEEE Transactions on Components, Packaging and Manufacturing Technology, Part C: Manufacturing. This is a peer-reviewed journal that publishes original research reports and review articles related to components, packaging, and manufacturing technology from around the world.
T-CPMC meaning in IEEE in Academic & Science
T-CPMC mostly used in an acronym IEEE in Category Academic & Science that means IEEE Transaction on Components, Packaging and Manufacturing Technology, Part C: (Manufacturing)
Shorthand: T-CPMC,
Full Form: IEEE Transaction on Components, Packaging and Manufacturing Technology, Part C: (Manufacturing)
For more information of "IEEE Transaction on Components, Packaging and Manufacturing Technology, Part C: (Manufacturing)", see the section below.
Essential Questions and Answers on IEEE Transaction on Components, Packaging and Manufacturing Technology, Part C: (Manufacturing) in "SCIENCE»IEEE"
What does IEEE T-CPMC stand for?
IEEE T-CPMC stands for "IEEE Transactions on Components, Packaging and Manufacturing Technology, Part C: Manufacturing".
Who is this journal aimed at?
This journal is aimed at researchers in the fields of components, packaging, and manufacturing technology from all around the world.
What type of content can I find in this journal?
You will be able to find original research papers as well as review articles related to components, packaging, and manufacturing technology in this journal.
Does this journal use a peer-review process?
Yes, all submissions undergo a rigorous peer-review process before being accepted for publication.
Is there an associated conference with this journal?
Yes, the annual International Conference on Multisensor Fusion and Information Integration (MFI) is associated with the IEEE Transactions on Components, Packaging and Manufacturing Technology.
Final Words:
: The IEEE Transactions on Components, Packaging and Manufacturing Technology (T-CPMC) provides researchers with an opportunity to share their latest findings about various aspects of components, packaging and manufacturing technology with the research community at large. All submissions are subject to a stringent peer-review process before they are published in the journal. Additionally, there is an international conference associated with it which helps foster closer links between research communities from different parts of the world.