What does JMM mean in JOURNALS
JMM is an abbreviation that stands for the Journal of Micromechanics and Microengineering. This journal is published by IOP Publishing in Bristol, United Kingdom. It was originally established in 1991 and since then has become a leading source of research in fields such as microelectromechanical systems (MEMS), nanotechnology, microfluidics and microfabrication. The journal publishes original research articles, reviews, tutorials and other scientific contributions from experts around the world in the field of micromechanics and microengineering. The goal of the journal is to provide a platform for authors to contribute their knowledge and experience in this rapidly changing field.
JMM meaning in Journals in Miscellaneous
JMM mostly used in an acronym Journals in Category Miscellaneous that means Journal of Micromechanics and Microengineering
Shorthand: JMM,
Full Form: Journal of Micromechanics and Microengineering
For more information of "Journal of Micromechanics and Microengineering", see the section below.
What Does JMM Stand For?
JMM stands for Journal of Micromechanics and Microengineering. It is a peer-reviewed international journal dedicated to the dissemination of fundamental knowledge related to all aspects of micromechanics, MEMS, nanotechnology, microfluidics and microfabrication. Through its monthly publication schedule it provides cutting-edge research from experts around the world including scientists, engineers, inventors and entrepreneurs who are exploring new ways to use these technologies in application areas such as communication networks, semiconductor fabrication processes, medical devices or consumer applications like robotics and sensors.
Overview
The Journal of Micromechanics and Microengineering publishes key contributions from authors around the world spanning both pure science as well as applied engineering topics related to micromechanics, MEMS technologies, nanotechnologies etc. Authors have reported on breakthroughs ranging from novel materials with improved properties down to molecular scale engineering involving DNA manipulation at atomic level accuracy; from hardware used for high- resolutions imaging systems down to software tools allowing integration into complex robotic systems; or even theoretical models based on quantum mechanics applicable in certain conditions such as putative superconductors at very low temperatures. The proceedings offer readers a broad overview on various trends within the field with interdisciplinary results addressing multi-scale problem solutions or unique perspectives on advanced fabrication techniques resulting in innovative devices with enhanced performance characteristics relevant for future technology advancements.
Essential Questions and Answers on Journal of Micromechanics and Microengineering in "MISCELLANEOUS»JOURNALS"
What information does the Journal of Micromechanics and Microengineering publish?
The Journal of Micromechanics and Microengineering publishes research in microsystems technology, including design, fabrication, integration, assembly and packaging. It also covers a range of topics such as actuation systems, micro-electro-mechanical systems (MEMS) and their applications.
Who is the audience for the Journal of Micromechanics and Microengineering?
The primary audience for this journal includes researchers, engineers, industrial scientists and professionals from the fields of nanotechnology and microsystems engineering. Additionally, other individuals interested in advances in these technologies may also be interested in this publication.
What type of articles are published in the Journal of Micromechanics and Microengineering?
The journal typically publishes original research papers (both theoretical and experimental), reviews or survey articles on all aspects of MEMS/NEMS technology as well as short communications detailing advances in emerging areas.
How often is the Journal of Micromechanics and Microengineering published?
This bimonthly journal is published six times per year on a schedule set by the publisher.
How can I prepare my article to meet the requirements for submission to the Journal of Micromechanics and Microengineering?
Authors should carefully review all formatting guidelines before preparing their paper for submission. These guidelines include topics such as word count limits, font types preferred for text body & equations, acceptable figure formats & sizes etc. Details regarding these guidelines can be found on the journal’s website.
How should I cite sources used in my article submitted to the Journal of Micromechanics and Microengineering?
Citations should follow standard Harvard referencing style. A detailed style guide can be obtained from Cambridge University Press or from Harvard Library’s website.
Can I submit a manuscript to other journals while it is being reviewed by the Editorial Board at ICMMME?
Yes, authors are allowed to submit their manuscripts to other journals provided they inform ICMMME about it upon submission so that there are no overlapping submissions received by any journal simultaneously.
Is there an article processing charge associated with submitting a manuscript to ICMMME?
No, there is no article processing charge associated with submitting manuscripts or articles to ICMMME or its affiliated journals at this time. However certain additional services may incur fee so authors must check with individual journals prior to engagement if necessary.
Final Words:
The Journal of Micromechanics and Microengineering (JMM) is an important resource for scientists and engineers looking to stay up-to-date on modern developments within this rapidly changing field. Its publication includes novel findings that have far reaching implications across multiple industries ranging from healthcare to consumer electronics. By publishing cutting edge research articles along with review papers written by experienced researchers worldwide JMM continues its mission of providing an invaluable platform for exchanging information about what's happening at this state-of-the-art frontier area of expertise.
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